Norsam functions as your failure analysis "service bureau," providing access to services, equipment and training needs you have using focused ion beam (FIB) technology with an eight nanometer beam accuracy.

Failure analysis is what a FIB was made for. The FIB is used mostly for cross sectioning integrated circuits but can be used to cross section most anything. The process begins by creating a hole in the chip or substrate with a high beam current then polishing one side of the hole with a fine small current. The stage is then tipped and a picture taken of the cross section.

Send us your integrated circuits and we'll send them back with polished cross sections and an image of the cross section. You can ship them and describe where to cut or come to our lab in Hillsboro, Oregon and navigate yourself.

Call/ email sales for quote: 505-984-1133 or 800-803-2688

Below are three different cross sections of computer chips. The first one is a three layer aluminum chip, the second is a cross section of a bond pad and the third is a six layer complicated copper process.